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COM Express Basic /
COM Express Type 6,
Type 7
Процессорные модули COM Express Basic / COM Express Type 6 и Type 7 с габаритами 95 х 125 мм обеспечивают большую производительность. Высокоскоростные интерфейсы подходят для широкого спектра применений, требующих больших вычислительных мощностей
НАЗАД
TGH960
COM Express Type 6, 11th Gen Intel® CPU, DDR4, 1 PCIe x16, 4 SATA 3.0, 8 USB 2.0, 4 USB 3.2, 1 VGA
Рабочая температура:
0 to 60°C, -40 to 85°C
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ICD970
COM Express R3.0 Type 7, 3rd Gen Intel® Xeon® Processor D-1700 Family, DDR4, 1 PCIe x16, 4 PCIe x 8
Рабочая температура:
0 to 60°C, -40 to 85°C
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CH961
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® CM246/QM370/HM370, DDR4, 1 PCIe x16, 8 PCIe x1
Рабочая температура:
0 to 60°C, -40 to 85°C
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CH961
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® CM246/QM370/HM370, DDR4, 1 PCIe x16, 8 PCIe x1
Рабочая температура:
0 to 60°C, -40 to 85°C
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GH960
COM Express Type 6, AMD® Ryzen™ V1000/R1000, DDR4, 1 PCIe x8, 7 PCIe x1, 12 USB, 1 or 2 SATA 3.0
Рабочая температура:
0 to 60°C, -40 to 85°C
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SH960MD-CM236/QM170
COM Express Type 6, 6th Gen Intel® Core™, DDR4, 1 PCIe x16, 8 PCI X1, 12 USB, 4 SATA 3.0, 1 VGA
Рабочая температура:
0 to 60°C, -40 to 85°C
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CH960-HM370
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® HM370, DDR4, 1 PCIe x16, 8 PCIe x1,12 USB
Рабочая температура:
0 to 60°C, -40 to 85°C
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CH960-CM246/QM370
COM Express Type 6, 8th/9th Gen Intel® Core™, Intel® CM246/QM370, DDR4, 1 PCIe x16, 8 PCIe x1,12 USB
Рабочая температура:
0 to 60°C, -40 to 85°C
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KH960-HM175
COM Express Type 6, 7th Gen Intel® Core™, Intel® HM175, DDR4, 1 PCIe x16, 12 USB, 4 SATA 3.0, 1 VGA
Рабочая температура:
0 to 60°C, -40 to 85°C
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KH960-CM238/QM175
COM Express Type 6, 7th Gen Intel® Core™, Intel® CM238/QM175, DDR4, 1 PCIe x16, 12 USB, 4 SATA 3.0
Рабочая температура:
0 to 60°C, -40 to 85°C
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SH960-HM170
COM Express Type 6, 6th Gen Intel® Core™, DDR4, 1 PCIe x16, 12 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 2 DDI
Рабочая температура:
0 to 60°C, -40 to 85°C
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SH960-CM236/QM170
COM Express Type 6, 6th Gen Intel® Core™, DDR4, 1 PCIe x16, 12 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 2 DDI
Рабочая температура:
0 to 60°C, -40 to 85°C
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TGH960
Процессорный модуль TGH960
11th Generation Intel® Processor COM Express® Basic
DDR4 3200MHz SO-DIMM up to 96GB, up to 128GB by request.
VGA + LVDS*/eDP + 3 DDI
DP++ supports 4K resolution
Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0
15-Year CPU Life Cycle Support Until Q2' 36 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
ICD970
Процессорный модуль ICD970
3rd Gen Intel® Xeon® Processor D-1700 Family
Default 2 260-pin DDR4 2666 SO-DIMM, dual channel mode up to 64GB, 3rd DIMM by request(SDPC mode by request to support DDR4 2933MHz)
Support extended operating temperature: -40 to 85°C
10GBASE-KR: Support up to 4 x 10GbE Mac ports
Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART (TX/RX)
Rich I/O: 2 Intel GbE, 4 USB 3.0, 4 USB 2.0, 2 SATA 3.0
15-Year CPU Life Cycle Support Until Q1' 37 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
CH961
Процессорный модуль CH961
Dual channel DDR4 2666MHz SODIMM up to 96GB
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
DP++ resolution supports up to 4096x2304 @ 60Hz
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
CH961
Процессорный модуль CH961
Dual channel DDR4 2666MHz SODIMM up to 96GB
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
DP++ resolution supports up to 4096x2304 @ 60Hz
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
GH960
Процессорный модуль GH960
AMD® Ryzen™ V1000/R1000 series processors
Dual channel DDR4 2400/3200MHz SODIMM up to 32GB
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI (* Default)
DP++ resolution supports up to 4096x2304 @ 60Hz
Multiple expansion: 1 PCIe x8, 6 PCIe x1
Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
10-Year CPU Life Cycle Support Until Q1' 28 (Based on AMD Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
SH960MD-CM236/QM170
Процессорный модуль SH960MD-CM236/QM170
Dual channel DDR4 2400MHz onboard Memory up to 16GB
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
eDP resolution supports up to 4096x2304 @ 60Hz
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
15-Year CPU Life Cycle Support Until Q3' 32 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
CH960-HM370
Процессорный модуль CH960-HM370
Dual channel DDR4 2666MHz SODIMM up to 64GB
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
eDP resolution supports up to 4096x2304 @ 60Hz
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
15-Year CPU Life Cycle Support Until Q2' 33 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
CH960-CM246/QM370
Процессорный модуль CH960-CM246/QM370
Dual channel DDR4 2666MHz SODIMM up to 64GB
Four display ports: VGA/DDI + LVDS/eDP + 2 DDI; Supports triple independent displays
eDP resolution supports up to 4096x2304 @ 60Hz
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
15-Year CPU Life Cycle Support Until Q2' 33 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
KH960-HM175
Процессорный модуль KH960-HM175
7th Gen Intel® Core™, Intel® HM175 Chipset
Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
Dual channel DDR4 2400MHz SODIMM up to 32GB
15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
KH960-CM238/QM175
Процессорный модуль KH960-CM238/QM175
7th Gen Intel® Core™, Intel® CM238/QM175 Chipset
Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
Dual channel DDR4 2400MHz SODIMM up to 32GB
15-Year CPU Life Cycle Support Until Q1' 32 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
SH960-HM170
Процессорный модуль SH960-HM170
6th Gen Intel® Core™, Intel® HM170 Chipset
Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
Dual channel DDR4 2133MHz SODIMM up to 32GB
15-Year CPU Life Cycle Support Until Q1' 31 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
SH960-CM236/QM170
Процессорный модуль SH960-CM236/QM170
6th Gen Intel® Core™, Intel® CM236/QM170 Chipset
Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0
Multiple expansion: 1 PCIe x16, 8 PCIe x1
Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays
Dual channel DDR4 2133MHz SODIMM up to 32GB
15-Year CPU Life Cycle Support Until Q1' 31 (Based on Intel IOTG Roadmap)
Диапазон температур:
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Производитель: DFI
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